News
  • FP-7 NanoFATE acronym project. Amepox is a part of consortium that is working with this project for researching influence nanosize materials for environment.
  • FP-7 PRIAM acronym project. Amepox is as a part of consortium that is working with this project for developing of radically new road signals and lighting modules (taillight) integrating heterogeneous functionalities on plastic foils for by high throughput homogenous processes.
  • Amepox is a part of consortium that is working with Eurypides program – PIDEA CANOPY (acronym) for developing new formulations with CNT’s for microelectronic applications.
  • Amepox is a part of consortium that is working with Eureka program – PIDEA MAJE (acronym) for developing Ink-Jet technology for microelectronic applications.
  • Amepox is a part of consortium that is working now with EU sponsored program – FP6 STABILIGHT (acronym). The goal of this program is a new generation of nanostructured photoemission materials and devices.
  • Amepox is worked as a part of consortium with EU sponsored program – FP5 NANOJOINING (acronym). The goal of this program is a new generation of ICA and TCA materials with nano sized fillers.
  • Amepox passed selection for Lockheed Martin Offset Program, and is a member of this program connected with Technology Acceleration U.
  • Amepox MC is developing new epoxy formulation for temporary fixing of electronic devices for SMT technology. This is special epoxy formulation with very high temperature resistance. This formulation can work up to 250C during ab. an hour.
  • Amepox MC is working with new version of product name Eco-Solder. This is version of “snap curing”, lead free, polymer base, electrically conductive paste for screen printing, stenciling or dispensing application with actual used on line production equipment.
  • Amepox MC has finished R&D work with new version of solderable after curing (silver filled) lacquer. Normal application for this product is covering non-metal elements or devices cure it. Then it is possible to use normal solder technique procedure at temp. 200 ± 5C (preferable 190 ± 5C) during max 6 sec. of time.
Amepox Microelectronics, Ltd. 90-268 d Jaracza str.6 Poland Phone: + 4842 6332202; Phone/Fax. +4842 6326957